高速高頻電路板就是電磁頻率較高的特種電路板，高頻的頻率在1GHz以上其各項物理性能、精度、技術參數(shù)要求都非常高，常用于雷達、軍事設備、航天航空等領域。領智電路是一家專業(yè)提供TU768 PCB打樣，TU768 PCB加工，TU768 PCB批量制作等一站式印刷電路板的生產廠家。TU-768 / TU-768P laminate / prepreg are made of high quality woven E-glass coated with the epoxy resin system, which provides the laminates with UV-block characteristic, and compatibility with automated optical inspection (AOI) process. These products are suitable for boards that need to survive severe thermal cycles, or to experience excessive assembly work. TU-768 laminates exhibit excellent CTE, superior chemical resistance and thermal stability plus CAF resistance property.
1. Applications
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Consumer Electronics
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Server, workstation
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Automotive
2. Performance and Processing Advantages
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Lead Free process compatible
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Excellent coefficient of thermal expansion
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Anti-CAF property
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Superior chemical and thermal resistance
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Fluorescence for AOI
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Moisture resistance
3. Industry Approvals
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IPC-4101E Type Designation : /98, /99, /101, /126
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IPC-4101E/126 Validation Services QPL Certified
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UL Designation - ANSI Grade: FR-4.0
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UL File Number: E189572
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Flammability Rating: 94V-0
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Maximum Operating Temperature: 130°C
4. Standard Availability
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Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
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Copper Foil Cladding: 1/8 to 12 oz (HTE) for built-up; 1/8 to 3 oz (HTE) for double sides and H to 2 oz (MLS)
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Prepregs: Available in roll or panel form
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Glass Styles: 106, 1080, 2113, 2116, 1506 and 7628 etc.
