高頻混壓板可以是FR4和高頻板材的混合，或者不同DK的高頻板材的混合，這種電路板具有耐高溫性能和優(yōu)異耐輻射性，這種結(jié)構(gòu)的高頻電路板能夠滿足局部高頻信號(hào)傳輸?shù)囊?，領(lǐng)智電路是一家專業(yè)提供TU863 PCB打樣，TU863 PCB加工，TU863 PCB批量制作等一站式印刷電路板的生產(chǎn)廠家。ThunderClad 1 High Tg halogen free low loss material is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application . Unlike conventional low loss material using brominated resin as flame retardant. ThunderClad 1 achieves flammability class of UL94V-0 by incorporating nitrogen compounds in the materials. ThunderClad 1 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, low signal attenuation and eliminate the use of potential hazardous halogenated resins.
1. Applications
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Backpanel, High performance computing
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Line cards, Storage
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Servers, Telecom, Base station
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Office Routers
2. Performance and Processing Advantages
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Halogen, antimony, and red phosphorous free
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Low Dk & Df performance
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Lead free process compatible
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Environmental friendly materials
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Compatible to PCB processes
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Low coefficient of thermal expansion
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Moisture resistance
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Anti-CAF capability
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Higher Tg characteristics
4. Industry Approvals
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IPC-4101E Type Designation : /127, /128, /130
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IPC-4101E/130 Validation Services QPL Certified
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UL Designation - ANSI Grade: FR-4.1
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UL File Number: E189572
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Flammability Rating: 94V-0
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Maximum Operating Temperature: 130°C
5. Standard Availability
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Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
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Copper Foil Cladding: 1/3 to 5 oz (HTE) for built-up & double sides and H to 2 oz (MLS)
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Prepregs: Available in roll or panel form
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Glass Styles: 106, 1080, 3313, 2116 etc and other prepreg grades are available upon request
