高頻混壓板可以是FR4和高頻板材的混合，或者不同DK的高頻板材的混合，這種電路板具有耐高溫性能和優(yōu)異耐輻射性，這種結(jié)構(gòu)的高頻電路板能夠滿足局部高頻信號傳輸?shù)囊?，領(lǐng)智電路是一家專業(yè)提供TU872 PCB打樣，TU872 PCB加工，TU872 PCB批量制作等一站式印刷電路板的生產(chǎn)廠家。TU-872 LK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application. TU-872 LK material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 LK laminates also exhibit excellent CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.
1. Applications
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Backpanel, High performance computing
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Line cards, Storage
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Servers, Telecom, Base station
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Office Routers
2. Performance and Processing Advantages
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Excellent electrical properties
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Dielectric constant less than 4.0
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Dissipation factor less than 0.010
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Stable and flat Dk/Df performance
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Compatible with most FR-4 processes
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Lead free process compatible
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Improved z-axis thermal expansion
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Anti-CAF capability
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Superior dimensional stability, thickness uniformity and flatness
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Excellent through-hole and soldering reliability
3. Industry Approvals
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IPC-4101E Type Designation : /29, /99, /101, /126
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IPC-4101E/126 Validation Services QPL Certified
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UL Designation - ANSI Grade: FR-4.0
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UL File Number: E189572
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Flammability Rating: 94V-0
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Maximum Operating Temperature: 130°C
4. Standard Availability
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Thickness: 0.002” [0.05mm] to 0.062” [1.58mm], available in sheet or panel form
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Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
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Prepregs: Available in roll or panel form
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Glass Styles: 106, 1080, 3313, 2116 and other prepreg grades are available upon request
