高頻混壓板可以是FR4和高頻板材的混合，或者不同DK的高頻板材的混合，這種電路板具有耐高溫性能和優(yōu)異耐輻射性，這種結(jié)構(gòu)的高頻電路板能夠滿足局部高頻信號傳輸?shù)囊?，領(lǐng)智電路是一家專業(yè)提供TU933 PCB打樣，TU933 PCB加工，TU933 PCB批量制作等一站式印刷電路板的生產(chǎn)廠家。ThunderClad 3 is an advanced material designed for high speed computing, telecommunications, radio frequency super low loss filed applications. ThunderClad 3’s electrical performance is competitive with PTFE-based, hydrocarbon-based very low loss materials, but capable for high layer count circuit board design with excellent thermal reliability.ThunderClad 3 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and also compatible with modified FR-4 processes.
1. Applications
-
Radio frequency
-
Backplane, High performance computing
-
Line cards, Storage
-
Servers, Telecom, Base station
-
Office Routers
2. Performance and Processing Advantages
-
Excellent electrical and thermal properties
-
Dielectric constant is 3.4 @ 10Gz
-
Dissipation factor is 0.0025 @ 10Ghz
-
Stable and flat Dk/Df performance over frequency and temperature variance.
-
Compatible with modified FR-4 processes
-
Excellent moisture resistance and Lead Free reflow process compatible
-
Improved z-axis thermal expansion
-
Superior dimensional stability, thickness uniformity and flatness
-
Anti-CAF capability
-
Excellent through-hole and soldering reliability
3. Industry Approvals
-
IPC-4101E Specification Number : /102
-
IPC-4101E/102 Validation Services QPL Certified
-
UL File Number: E189572
-
ANSI Grade: No-ANSI
-
Flammability Rating: 94V-0
-
Maximum Operating Temperature: 140°C
4. Standard Availability
-
Thickness: 0.002”[0.05mm] to 0.062”[1. 58mm], available in sheet or panel form
-
Copper Foil Cladding: 1/3 to 5 oz for built-up & double sides
-
Prepregs: Available in roll or panel form
-
Glass Styles: 1035, 1078, 2113, 2116 and other prepreg grades are available upon request.
